Convida Wireless is a joint venture between InterDigital and Sony America formed in 2013 for driving new IoT innovation in the field of machine-to-machine (M2M) communications and other connectivity technologies. It is a good example of strategic alliances between NPE and PE to combine Sony's consumer electronics production expertise with InterDigital's pioneering wireless research for IPR generation.
Recent patent research for the M2M communication technologies (ref. http://techipm-innovationfrontline.blogspot.com/2015/03/m2m-d2d-communications-for-iot.html) showed that Convida Wireless ranked 14th in number of patent applications among 58 IPR holders. Convida Wireless’ patents cover M2M/IoT systems that include devices such as sensors, gateways to other networks and back-end servers. Convida Wireless’ patents also cover M2M/IoT systems’ performances such as devices management, data collection from the devices, data storage and data processing and data querying from users or applications.
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