Convida Wireless is a joint venture between
InterDigital and Sony America formed in 2013 for driving new IoT innovation in
the field of machine-to-machine (M2M) communications and other connectivity
technologies. It is a good example of strategic alliances between NPE and PE to
combine Sony's consumer electronics production expertise with InterDigital's
pioneering wireless research for IPR generation.
Recent patent research for the M2M
communication technologies (ref.
http://techipm-innovationfrontline.blogspot.com/2015/03/m2m-d2d-communications-for-iot.html)
showed that Convida Wireless ranked 14th in number of patent applications among
58 IPR holders. Convida Wireless’ patents cover M2M/IoT systems that include
devices such as sensors, gateways to other networks and back-end servers.
Convida Wireless’ patents also cover M2M/IoT systems’ performances such as
devices management, data collection from the devices, data storage and data
processing and data querying from users or applications.
For more information, please contact Alex Lee
at alexglee@techipm.com .
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